Development history

 

2024

  • Wafer-Level Advanced Packaging Project Connections
  • Passed the IS09001 quality system review certification
  • Awarded Shenzhen Longgang District High Density Flip Chip Sealing Engineering Technology R&D Center

 

2023

  • Accredited as Guangdong Provincial engineering technology research center
  • The main body of SCI plant in Shenzhen Pingxi Park was topped out

 

2022

  • We passed ISO13485 certification
  • We started the first IPC standard
  • Undertake the operation of Shenzhen IC testing and verification engineering technology center

 

2021

  • We received Guangdong Provincial Little giants
  • Shenzhen Pingxi Park SCI plant construction began

 

2020

  • We officially renamed “ Sky Chip Interconnection Technology Co., Ltd"
  • Sky Chip Interconnection Technology Co., Ltd. Wuxi Branch was established
  • Shenzhen branch was deregistered

 

2019

  • We received gazelle enterprise in South of Jiangsu
  • Accredited as "Enterprise Technical Center“ in Wuxi
  • "Smart workshop"in Wuxi
  • Earned SCI's first Lean Six Sigma Black Belt certification

 

2018

  • We passed ISO14001 & ESD certification at first time
  • We received the “Innovation and Entrepreneurship Award” of Wuxi Hi-Tech Zone
  • Shenzhen branch was established

 

2016

  • We received the accreditation of "National High-tech Enterprises";
  • Passed ISO9001 qualification certification for the first time.

 

2015

  • We officially renamed “Wuxi Sky Chip Interconnection Technology Co., Ltd";
  • The registered capital was increased to 50 million.

 

2012

  • R&D Center of Wuxi SCC was established.

 

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